E-Beam Evaportion System
HANSLINK Co.,Ltd .TEL: 886-937-119181 .FAX: 886-36688378 .EMAIL:harrison@hanslinkinc.com .ADD:No. 46, Jiazheng 1st St., Zhubei City, Hsinchu County 302, Taiwan (R.O.C.)
1. The e-beam system is specifically designed for deposition of a wide variety of materials including metals, dielectrics, oxides, semiconductors and alloys for R&D laboratory and pilot production applications 2. The system is capable of uniform deposition of ≦±5% (center-to-edge) 3. The system can be configured with an ion source for ion-beam cleaning. 4. System is available with different vacuum pumps including mechanical, dry-pump, turbo-pump, and cryo-pump for high-vacuum and ultra-high vacuum applications 5. Additional features include versatility, ease of operation, and long term reliability for evaporation of single and multiple layers of thin or thick films
Wafer Size
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≦ 6”
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Ultimate Pressure
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≦ 8E-7 Torr
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Process Vacuum
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≦ 5E-6 Torr in 40 min.
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Substrate Rotate Rate
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5~30rpm
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Thickness Uniformity
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≦±5%
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Pocket Number and Size
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4 or 6 pockets/ 7~25cc
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Control System
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PLC / PLC+PC
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Optional
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1. Cooling System
2. Ion Source
3. Heating System
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DOWNLOAD:
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