Sputtering Deposition System
HANSLINK Co.,Ltd
．TEL： 886-937-119181
．FAX： 886-36688378
．EMAIL：harrison@hanslinkinc.com
．ADD：No. 46, Jiazheng 1st St., Zhubei City, Hsinchu County 302, Taiwan (R.O.C.)
Sputtering Deposition System
1. Key performance features include the uniform deposition of metal, dielectric, insulator, magnetic and paramagnetic films on a wide variety of substrate materials and different shapes
2. Additional features include versatility, ease of operation, and long term reliability for sputtering of single and multiple layers of thin or thick films
3. System can be operated in Manual, Semi-auto, or Fully-auto mode
4. Capable of uniform deposition of ≦±5% (center-to-edge)
5. Sputter-guns with variable telescoping (cathode to substrate distance) and flexible joints for variable angle of incidence with provision for use with clamped or bonded sputter targets
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Sputtering Direction
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Up/Down
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Target Size
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Φ2” -Φ6”
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Substrate Size
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Φ3”-Φ8”
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Substrate Rotate Rate
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5~30rpm
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Thickness Uniformity
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±3%, ±5%
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Ultimate Pressure
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≦ 8E-7 Torr
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Sputter Power Supply
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DC / RF
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Heating Mechanism
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RT~600℃
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Mass Flow Control
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10~500sccm
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Control System
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PLC / PLC+PC
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Optional
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1. Substrate Bias
2. Cooling System
3. Thickness monitor
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%MCEPASTEBIN%
DOWNLOAD:
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